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Mitsubishi Electric to Launch "SLIMDIP-X" Power Semiconductor Module Reduced thermal resistance and noise will realize simpler, smaller inverter systems for appliances

FOR IMMEDIATE RELEASE No. 3488

TOKYO, February 15, 2022 - Mitsubishi Electric Corporation (TOKYO: 6503) announced today that its new SLIMDIP-X power semiconductor module, which achieves low thermal resistance and noise for use in home-appliance inverter systems, will be released on February 18. This new module in the SLIMDIP™ series is expected to help simplify and reduce the size of inverter systems used in products such as air conditioners, washing machines and refrigerators.

SLIMDIP-X

Product Features

1)Reduced thermal resistance will contribute to simpler thermal designs
- An upgraded insulation sheet reduces thermal resistance between the chip and case by approximately 35% compared to the existing SLIMDIP-L module, and the rating current has been increased to 20A.
- High-temperature suppression in the reverse-conducting IGBT (RC-IGBT) will help to simplify the thermal designs for inverter systems.
2)Low noise will help realize smaller, lower-cost inverter systems
- Noise reduction technology deployed in the RC-IGBT helps to reduce the number of noise suppression components, which will lead to smaller and lower-cost inverter systems.
3)SLIMDIP series package compatibility helps to shorten design time
- Adopting a SLIMDIP series-compatible package, including dimensions and pin layout (while nevertheless increasing the rating current), will greatly help to shorten inverter-system designing.